Machine and process
We detail here the machine and the processes we regularly support in our machine. All other process need to be discussed with the staff member before being performed in the Centre.
|Silicon ICP-DRIE Alcatel|
The machine is working
Brand/Model: Alcatel / 601
Description: Silicon can be etched in an anisotropic (or isotropic) and dry way with the technology called “deep RIE”. This method combines deposition and etching plasma assisted processes. While the silicon is etched, the process enables to deposit a fluorinated component on the pattern walls in order to passivate them. Etching-deposition cycles with given gases and time enable to etch deeply and anisotropically the silicon independently of its orientation.
Person in charge: Chollet Franck
Authorized operators: Undergraduate Research Student Research Staff
Note that when you are logged as a user, the process list includes the process cost.
The Booking cost is the cost when you operate the equipment yourself (and book it) while the Request cost is when a Centre Staff is performing the process for you.